NSN: 5910-01-230-2881

Technical Characteristics

• Overall Height (Non-Core)

  0.060 inches maximum

• Precious Material

  palladium and silver

• Overall Length (Non-Core)

  0.175 inches nominal

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Terminal Surface Treatment

  palladium and silver

• Body Style

  chip type

• Tolerance Range Per Section

  -0.50/+0.50 picofarads single section

• Nonderated Continuous Voltage Rating And Type Per Section

  150.0 dc single section

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Capacitance Value Per Section

  9525.000 picofarads single section

• Case Material

  ceramic

• Terminal Type And Quantity

  2 bonding pad

• Body Length

  0.175 inches nominal

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Insulation Resistance At Maximum Operating Temp

  1000.0 megohms

• Reliability Indicator

  not established

• Body Height

  0.060 inches maximum

• Dissipation Factor At Reference Temp In Percent

  0.100

• Body Width

  0.125 inches nominal

• Terminal Length

  0.010 inches minimum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Overall Width (Non-Core)

  0.125 inches nominal

• Precious Material And Location

  terminal surfaces palladium and terminal surfaces silver

• Insulation Resistance At Reference Temp

  100000.0 megohms