NSN: 5910-01-244-9384

Technical Characteristics

• Body Width

  0.035 inches minimum and 0.065 inches maximum

• Body Height

  0.050 inches maximum

• Terminal Type And Quantity

  2 bonding pad

• Overall Height (Non-Core)

  0.050 inches maximum

• Capacitance Value Per Section

  2.200 picofarads single section

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -20.0/+20.0 single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Overall Length

  0.035 inches minimum and 0.065 inches maximum

• Overall Width

  0.035 inches minimum and 0.065 inches maximum

• Tolerance Range Per Section

  -0.25/+0.25 picofarads single section

• Body Length

  0.035 inches minimum and 0.065 inches maximum

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Terminal Length

  0.010 inches nominal

• Body Style

  chip type

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Case Material

  ceramic

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section