NSN: 5910-01-258-3274

Technical Characteristics

• Test Data Document

  81349-mil-c-55681 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• ~1

  data on certain environmental and performanc

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Dissipation Factor At Reference Temp In Percent

  2.5000

• Body Style

  chip type

• Case Material

  ceramic

• Overall Length (Non-Core)

  0.180 inches nominal

• Capacitance Value Per Section

  56000.000 picofarads single section

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -25.0/+15.0 with rated voltage applied single section

• Terminal Type And Quantity

  2 bonding pad

• Reliability Failure Rate Level In Percent

  0.0010

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Specification/Standard Data

  81349-mil-c-55681/1 government specification

• Reliability Indicator

  established

• Body Length

  0.180 inches nominal

• Terminal Surface Treatment

  solder

• Overall Height

  0.020 inches minimum and 0.080 inches maximum

• Body Height

  0.020 inches minimum and 0.080 inches maximum

• Body Width

  0.125 inches nominal

• Terminal Length

  0.020 inches nominal

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Overall Width (Non-Core)

  0.125 inches nominal

• Insulation Resistance At Reference Temp

  100000.0 megohms