NSN: 5910-01-285-6498

Technical Characteristics

• ~1

  data on certain environmental and performanc

• Test Data Document

  81349-mil-c-55681 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• Dissipation Factor At Reference Temp In Percent

  2.500

• Body Style

  chip type

• Overall Width

  2.6 millimeters minimum and 3.0 millimeters maximum

• Case Material

  ceramic

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -25.0/+15.0 with rated voltage applied single section

• Terminal Type And Quantity

  2 bonding pad

• Capacitance Value Per Section

  22000.000 picofarads single section

• Overall Height (Non-Core)

  1.8 millimeters maximum

• Overall Length

  3.5 millimeters minimum and 4.0 millimeters maximum

• Reliability Failure Rate Level In Percent

  0.001

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Specification/Standard Data

  81349-mil-c-55681/9 government specification

• Reliability Indicator

  established

• Terminal Surface Treatment

  solder

• Terminal Length

  0.2 millimeters minimum and 0.7 millimeters maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Body Length

  2.9 millimeters minimum and 3.4 millimeters maximum

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Body Width

  2.2 millimeters minimum and 2.7 millimeters maximum

• Body Height

  1.5 millimeters maximum

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)