NSN: 5910-01-293-3961

Technical Characteristics

• Dissipation Factor At Reference Temp In Percent

  0.600

• Terminal Length

  0.010 inches minimum and 0.035 inches maximum

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -15.0/+15.0 without voltage applied single section

• Reliability Indicator

  not established

• Terminal Surface Treatment

  solder

• Body Height

  0.065 inches maximum

• Overall Length

  0.085 inches minimum and 0.105 inches maximum

• Terminal Type And Quantity

  2 bonding pad

• Case Material

  ceramic

• Overall Height (Non-Core)

  0.065 inches maximum

• Body Length

  0.085 inches minimum and 0.105 inches maximum

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Body Style

  chip type

• Capacitance Value Per Section

  1000.000 picofarads single section

• Body Width

  0.040 inches minimum and 0.065 inches maximum

• Overall Width

  0.040 inches minimum and 0.065 inches maximum