NSN: 5910-01-295-0104

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Dissipation Factor At Reference Temp In Percent

  0.001

• Overall Length

  0.085 inches minimum and 0.140 inches maximum

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Power Factor At Reference Temp In Percent

  1000.000

• Nonderated Continuous Voltage Rating And Type Per Section

  70.0 dc single section

• Reliability Indicator

  not established

• Overall Height (Non-Core)

  0.110 inches maximum

• Tolerance Range Per Section

  -2.00/+2.00 percent single section

• Terminal Length

  0.010 inches minimum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Capacitance Value Per Section

  680.000 picofarads single section

• Precious Material And Location

  terminal surfaces silver

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Body Width

  0.040 inches minimum and 0.060 inches maximum

• Overall Width

  0.040 inches minimum and 0.060 inches maximum

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Body Style

  chip type

• Body Height

  0.110 inches maximum

• Precious Material (Non-Core)

  silver

• Case Material

  ceramic

• Body Length

  0.085 inches minimum and 0.140 inches maximum

• Terminal Surface Treatment

  silver