NSN: 5910-01-318-1695

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Body Width

  0.110 inches nominal

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Reliability Indicator

  established

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Terminal Surface Treatment

  solder

• Body Height

  0.110 inches nominal

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Capacitance Value Per Section

  680.000 picofarads single section

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Specification/Standard Data

  37695-mil-c-23269 government specification

• Body Style

  chip type

• Body Length

  0.110 inches nominal

• Case Material

  ceramic

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Tolerance Range Per Section

  -0.00/+10.00 percent single section

• End Item Identification

  mfx 711-1