NSN: 5910-01-360-5388

Technical Characteristics

• Capacitance Value Per Section

  30.000 picofarads single section

• Terminal Type And Quantity

  2 bonding pad

• Power Factor At Reference Temp In Percent

  10000.000

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -20.0/+20.0 single section

• Overall Width (Non-Core)

  0.055 inches nominal

• Body Length

  0.055 inches nominal

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Overall Length (Non-Core)

  0.055 inches nominal

• Body Width

  0.055 inches nominal

• Overall Height (Non-Core)

  0.055 inches nominal

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Terminal Length

  0.010 inches nominal

• Body Style

  chip type

• Body Height

  0.055 inches nominal

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Case Material

  ceramic

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Tolerance Range Per Section

  -5.00/+5.00 percent single section