NSN: 5910-01-377-7170

Technical Characteristics

• Body Height

  1.4 millimeters minimum and 1.8 millimeters maximum

• Dissipation Factor At Reference Temp In Percent

  2.500

• Body Style

  chip type

• Body Width

  1.7 millimeters minimum and 2.1 millimeters maximum

• Overall Width

  1.7 millimeters minimum and 2.1 millimeters maximum

• Case Material

  ceramic

• Terminal Type And Quantity

  2 bonding pad

• Capacitance Value Per Section

  10.000 nanofarads single section

• Overall Length

  3.5 millimeters minimum and 3.9 millimeters maximum

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Terminal Length

  0.2 millimeters minimum and 0.7 millimeters maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Overall Height

  1.4 millimeters minimum and 1.8 millimeters maximum

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Nonderated Continuous Voltage Rating And Type Per Section

  200.0 dc single section

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Body Length

  3.5 millimeters minimum and 3.9 millimeters maximum