NSN: 5910-01-380-6294

Technical Characteristics

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Nonderated Continuous Voltage Rating And Type Per Section

  200.0 dc single section

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Reliability Indicator

  not established

• Terminal Surface Treatment

  solder

• Body Length

  3.500 millimeters minimum and 3.900 millimeters maximum

• Terminal Length

  0.200 millimeters minimum and 0.800 millimeters maximum

• Body Width

  1.700 millimeters minimum and 2.100 millimeters maximum

• Nonderated Operating Temp

  55.0 deg celsius minimum and 125.0 deg celsius maximum

• Terminal Type And Quantity

  2 bonding pad

• Body Height

  1.400 millimeters minimum and 1.800 millimeters maximum

• Case Material

  ceramic

• Body Style

  chip type

• Capacitance Value Per Section

  4.7000 nanofarads single section

• Dissipation Factor At Reference Temp In Percent

  2.500