NSN: 5910-01-382-8243

Technical Characteristics

• Insulation Resistance At Maximum Operating Temp

  1000000.0 megohms

• Precious Material

  palladium and silver

• Precious Material And Location

  terminals palladium and terminals surfaces silver

• Quality Factor At Reference Temp

  3000.000

• Case Material

  glass

• Terminal Length

  0.13 millimeters minimum and 0.64 millimeters maximum

• Body Height

  0.76 millimeters minimum and 2.60 millimeters maximum

• Test Data Document

  80063-a3132190 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Overall Width

  2.29 millimeters minimum and 3.29 millimeters maximum

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Overall Height

  0.76 millimeters minimum and 2.6 millimeters maximum

• Body Style

  chip type

• Terminal Surface Treatment

  palladium and silver and nickel

• Insulation Resistance At Reference Temp

  10000000.0 megohms

• Tolerance Range Per Section

  -1.00/+1.00 percent single section

• Dissipation Factor At Reference Temp In Percent

  0.050

• Nonderated Continuous Voltage Rating And Type Per Section

  500.0 dc single section

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Capacitance Value Per Section

  35.000 picofarads single section

• Terminal Type And Quantity

  2 bonding pad

• Body Length

  2.29 millimeters minimum and 3.68 millimeters maximum

• Overall Length

  2.29 millimeters minimum and 3.68 millimeters maximum

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -70.0/+110.0 single section

• Reliability Indicator

  not established

• Body Width

  2.29 millimeters minimum and 3.29 millimeters maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum