NSN: 5910-01-384-1859

Technical Characteristics

• Dissipation Factor At Reference Temp In Percent

  0.050

• Case Material

  ceramic

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Terminal Type And Quantity

  2 bonding pad

• Body Height

  0.020 inches minimum and 0.057 inches maximum

• Body Width

  0.030 inches minimum and 0.080 inches maximum

• Capacitance Value Per Section

  2.200 picofarads single section

• Body Length

  0.040 inches minimum and 0.070 inches maximum

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Body Style

  chip type

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Insulation Resistance At Reference Temp

  10000000.0 megohms

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -20.0/+20.0 single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Range Per Section

  -0.100/+0.100 picofarads single section

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Reference Temp At Which Rated

  25.0 deg celsius