NSN: 5910-01-385-4261

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Body Length

  0.126 inches nominal

• Capacitance Value Per Section

  0.330 microfarads single section

• Insulation Resistance At Maximum Operating Temp

  1000.0 megohms

• Body Height

  0.067 inches maximum

• Reliability Indicator

  not established

• Insulation Resistance At Reference Temp

  10000.0 megohms

• Terminal Surface Treatment

  nickel

• Terminal Length

  0.010 inches minimum and 0.028 inches maximum

• Tolerance Range Per Section

  -20.00/+80.00 percent single section

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Case Material

  ceramic

• Nonderated Operating Temp

  10.0 deg celsius minimum and 85.0 deg celsius maximum

• Dissipation Factor At Reference Temp In Percent

  3.000

• Body Style

  chip type

• Body Width

  0.098 inches nominal

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -56.0/+22.0 with rated voltage applied single section