NSN: 5910-01-386-7789

Technical Characteristics

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Body Style

  chip type

• Overall Width (Non-Core)

  0.110 inches nominal

• Body Height

  0.040 inches minimum and 0.100 inches maximum

• Body Length

  0.110 inches nominal

• Dissipation Factor At Reference Temp In Percent

  0.050

• Case Material

  ceramic

• Nonderated Continuous Voltage Rating And Type Per Section

  500.0 dc single section

• Capacitance Value Per Section

  1.200 picofarads single section

• Tolerance Range Per Section

  -0.10/+0.10 picofarads single section

• Terminal Type And Quantity

  2 bonding pad

• Body Width

  0.110 inches nominal

• Overall Height

  0.040 inches minimum and 0.100 inches maximum

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -15.0/+15.0 single section

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Overall Length (Non-Core)

  0.110 inches nominal

• Schematic Diagram Designator

  no common or grounded electrode(s)