NSN: 5935-00-865-4174

Technical Characteristics

• Precious Material And Location

  contact surfaces gold

• Contact Material

  beryllium copper

• Body Mounting Hole Accommodation Diameter

  0.375 inches nominal

• Mounting Type For Which Designed

  chassis

• Fabrication Method

  molded

• Body Material

  plastic and glass

• Precious Material

  gold

• Specific Equipment Accommodated

  semiconductor device

• Overall Height

  0.237 inches nominal

• Mounting Hole Style

  round, flatted

• Contact Position Arrangement Style

  circular

• Precious Material And Weight

  0.008 gold grains, troy

• Terminal Type And Quantity

  8 pin

• Accommodated Contact Quantity

  8

• Contact Surface Treatment

  gold and copper