NSN: 5935-00-998-9309

Technical Characteristics

• Specific Equipment Accommodated

  semiconductor device

• Terminal Length

  0.141 inches nominal

• Mounting Hole Style

  round, body

• Accommodated Contact Quantity

  6

• Body Mounting Hole Accommodation Diameter

  0.370 inches minimum and 0.375 inches maximum

• Overall Diameter

  0.390 inches minimum and 0.410 inches maximum

• Contact Position Arrangement Style

  circular

• Precious Material And Weight

  0.006 gold grains, troy

• Projection Length Above Mounting Surface

  0.062 inches nominal

• Precious Material And Location

  c0ntact surfaces gold

• Contact Maximum Current Rating In Amps

  1.0

• Polarization Type

  slot

• Mounting Method

  press fit

• Contact Material

  beryllium copper

• Body Material

  plastic

• Body Style

  top mount, press fit

• Temp Rating

  -65.0 deg celsius and 150.0 deg celsius

• Contact Resistance In Ohms

  0.009

• Mounting Type For Which Designed

  chassis

• Contact Surface Treatment

  gold and nickel

• Fabrication Method

  molded

• Overall Height

  0.408 inches nominal

• Terminal Type And Quantity

  6 solder well

• Precious Material

  gold