NSN: 5935-01-253-3326

Technical Characteristics

• Thread Direction

  right-hand

• Body Style

  30b wafer type

• Overall Length

  1.250 inches nominal

• Mounting Hole Diameter

  0.156 inches nominal

• Distance Between Mounting Facility Centers

  0.960 inches nominal

• Contact Material

  beryllium copper

• Contact Surface Treatment

  gold and nickel

• Thread Quantity Per Inch

  32

• Nominal Thread Size

  0.138 inches

• Ground Terminal Type And Quantity

  1 tab, solder lug

• Iii Precious Material And Weight

  0.002 gold grains, troy

• Thread Series Designator

  unc

• Body Material

  glass and plastic

• Thread Class

  2b

• Overall Height

  0.656 inches maximum

• Overall Width

  0.700 inches maximum

• Mounting Hole Style

  17d two mounting holes/slots, in-line

• Contact Maximum Current Rating In Amps

  10.0

• Accommodated Contact Quantity

  2

• Polarization Type

  contact shape

• Projection Length Below Mounting Surface

  0.479 inches nominal

• Mounting Method

  threaded hole

• Mounting Type For Which Designed

  chassis

• Contact Position Arrangement Style

  218a in line

• Iii Precious Material And Location

  contact surfaces gold

• Iii Precious Material

  gold

• Terminal Type And Quantity

  2 tab, solder lug