NSN: 5950-00-912-9156

Technical Characteristics

• Inclosure Type

  hermetically sealed

• Winding Operating Current

  425.0 milliamperes nominal b and better drop siding single component 3rd secondary

• Winding Operating Current

  425.0 milliamperes nominal b and better drop siding single component 4th secondary

• Terminal Type And Quantity

  10 tab, solder lug

• Body Width

  4.750 inches minimum and 4.781 inches maximum

• Winding Operating Voltage

  180.00 ac pounds per hour wet single component 2nd secondary

• Mounting Facility Quantity

  4 single group

• Winding Operating Voltage

  115.00 ac pounds per hour wet single component single primary

• Overall Height

  6.437 inches maximum

• Winding Operating Voltage

  105.00 ac pounds per hour wet single component 1st secondary

• Mounting Hole Diameter

  0.281 inches nominal single group

• Mounting Method

  flange single group and unthreaded hole single group

• Winding Operating Voltage

  385.00 ac pounds per hour wet single component 3rd secondary

• Winding Operating Current

  25.0 milliamperes nominal b and better drop siding single component 2nd secondary

• Winding Operating Current

  30.0 milliamperes nominal b and better drop siding single component 1st secondary

• Winding Function And Quantity

  1 primary single component and 4 secondary single component

• Body Height

  6.000 inches nominal

• Winding Operating Voltage

  755.00 ac pounds per hour wet single component 4th secondary

• Body Length

  4.500 inches minimum and 4.562 inches maximum

• Center To Center Distance Between Mounting Facilities Parallel To Length

  3.812 inches nominal single mounting facility single center group

• Reliability Indicator

  not established

• Input-Output Phase Relationship

  single phase to single phase single component

• Frequency Rating

  60.0 hertz nominal single component

• Center To Center Distance Between Mounting Facilities Parallel To Width

  3.500 inches nominal single mounting facility single center group

• Winding Shielding Method

  internal shield grounded to inclosure single component