NSN: 5961-00-160-7688
Semiconductor Devices and Associated Hardware
SEMICONDUCTOR DEVICE SET
5961 - Semiconductor Devices and Associated Hardware
SEMICONDUCTOR DEVICE SET
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Technical Characteristics
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~1
all corners and/or edges are broken 0.015 in.max. component qty 6.
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Joint Electronic Device Engineering Council/Jedec/Case Outline Designation
do-35 all semiconductor
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Component Function Relationship
unmatched
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Special Features
package material to be fiberite 4004; raised numbers and letters not permitted; epoxy may touch but not encapsulate diode and shall be flush to 0.020 in. below top shell and on leads shall not extend more than 0.008 in. beyond base plane of shell body;
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