NSN: 5961-00-229-8429

Semiconductor Devices and Associated Hardware

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5961 - Semiconductor Devices and Associated Hardware

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Technical Characteristics

  • Inclosure Material

    metal

  • Overall Length

    0.750 inches nominal

  • Internal Configuration

    junction contact

  • Mounting Method

    threaded stud

  • Features Provided

    hermetically sealed case

  • Overall Width Across Flats

    0.875 inches maximum

  • Nominal Thread Size

    0.312 inches

  • Semiconductor Material

    silicon

  • Current Rating Per Characteristic

    7.50 amperes maximum base current,dc and 30.00 amperes maximum collector current,dc

  • Power Rating Per Characteristic

    200.0 milliwatts maximum collector power dissipation

  • Maximum Operating Temp Per Measurement Point

    200.0 deg celsius junction

  • Terminal Type And Quantity

    3 tab,solder lug

  • Mounting Facility Quantity

    1

  • Internal Junction Configuration

    npn

  • Voltage Rating In Volts Per Characteristic

    100.0 maximum breakdown voltage,collector-to-base,emitter open and 100.0 maximum breakdown voltage,collector-to-emitter,base open and 15.0 maximum breakdown voltage,emitter-to-base,collector open

  • Thread Series Designator

    unf

  • Specification/Standard Data

    80131-release4201 professional/industrial association specification

Certified to
AS6081 Methods

Implementing Quality Procurement

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