NSN: 5961-00-466-3456
Semiconductor Devices and Associated Hardware
SEMICONDUCTOR DEVICE,PHOTO
- Lockheed Martin Corporation
- U S Army Aviation And Missile
- U S Army Armament Research &
- Excelitas Technologies
- Microsemi Corp.-Integrated Products
- Microsemi Corp.-Integrated Products
- Northrop Grumman Guidance And
- Northrop Grumman Guidance And
- Program Manager Advanced Attack
- Eg And G Inc
- Eg And G Inc
- Thales
- Thales
5961 - Semiconductor Devices and Associated Hardware
SEMICONDUCTOR DEVICE,PHOTO
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Technical Characteristics
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Maximum Operating Temp Per Measurement Point
150.0 deg celsius ambient air
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Special Features
junction pattern arrangement: pn
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Terminal Type And Quantity
3 uninsulated wire lead
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Mounting Method
terminal
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Overall Diameter
0.360 inches maximum
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Response Time
0.6 microseconds maximum
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Precious Material
gold
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Precious Material And Location
terminals gold
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Inclosure Material
glass
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Internal Configuration
junction contact
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Features Provided
hermetically sealed case
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Overall Length
0.165 inches maximum
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Semiconductor Material
silicon
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Terminal Length
1.500 inches minimum
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Voltage Rating In Volts Per Characteristic
150.0 maximum nominal regulator voltage
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Terminal Circle Diameter
0.100 inches nominal
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Current Rating Per Characteristic
1.00 milliamperes forward current, average minor
Related Parts by Category
Related Manufacturers
- Lockheed Martin Corporation
- U S Army Aviation And Missile
- U S Army Armament Research &
- Excelitas Technologies
- Microsemi Corp.-Integrated Products
- Microsemi Corp.-Integrated Products
- Northrop Grumman Guidance And
- Northrop Grumman Guidance And
- Program Manager Advanced Attack
- Eg And G Inc
- Eg And G Inc
- Thales
- Thales