NSN: 5961-01-196-6940

Semiconductor Devices and Associated Hardware

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5961 - Semiconductor Devices and Associated Hardware

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Technical Characteristics

  • Overall Diameter

    0.061 inches maximum

  • Internal Configuration

    junction contact

  • Internal Junction Configuration

    npn

  • Mounting Method

    press fit

  • Semiconductor Material

    silicon

  • Current Rating Per Characteristic

    10.00 milliamperes maximum forward current,dc

  • Maximum Operating Temp Per Measurement Point

    135.0 deg celsius junction

  • Inclosure Material

    plastic

  • Overall Length

    0.092 inches maximum

  • Voltage Rating In Volts Per Characteristic

    100.0 maximum breakdown voltage,dc

  • Power Rating Per Characteristic

    225.0 milliwatts maximum total device dissipation

  • Terminal Type And Quantity

    3 ribbon

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