NSN: 5961-01-261-4376

Semiconductor Devices and Associated Hardware

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5961 - Semiconductor Devices and Associated Hardware

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Technical Characteristics

  • Overall Length

    0.980 inches nominal

  • Overall Width

    0.400 inches nominal

  • Terminal Type And Quantity

    2 bonding pad

  • Inclosure Material

    ceramic

  • Overall Height

    0.270 inches nominal

  • Special Features

    contains hazardous material beryllium oxide must be disposed of as toxic waste

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