NSN: 5961-01-294-4710

Semiconductor Devices and Associated Hardware

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5961 - Semiconductor Devices and Associated Hardware

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Technical Characteristics

  • Inclosure Material

    metal

  • Overall Width

    0.990 inches minimum and 1.090 inches maximum

  • Mounting Facility Quantity

    2

  • Internal Configuration

    junction contact-darlington connected

  • Joint Electronic Device Engineering Council/Jedec/Case Outline Designation

    to-3

  • Electrode Internally-Electrically Connected To Case

    collector

  • Mounting Method

    unthreaded hole

  • Features Provided

    burn in and hermetically sealed case

  • Semiconductor Material

    silicon

  • Terminal Type And Quantity

    2 pin and 1 case

  • Special Features

    junction pattern arrangement: npn

  • Maximum Operating Temp Per Measurement Point

    175.0 deg celsius junction

  • Power Rating Per Characteristic

    100.0 watts maximum total power dissipation

  • Current Rating Per Characteristic

    10.00 amperes maximum collector current, dc and 10.00 amperes maximum base current, dc

  • Voltage Rating In Volts Per Characteristic

    80.0 maximum collector to emitter voltage/static/base open and 80.0 maximum collector to base voltage/static/emitter open and 5.0 maximum emitter to base voltage, static, collector open

  • Overall Height

    0.250 inches minimum and 0.450 inches maximum

  • Overall Length

    1.439 inches minimum and 1.573 inches maximum

Certified to
AS6081 Methods

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