NSN: 5961-01-332-8089

Technical Characteristics

• ~1

  type data on certain environmental and perfor

• Current Rating Per Characteristic

  50.00 microamperes forward current, average peak

• Precious Material And Location

  eutetic die bonds,surface terminals -land areas- a gold

• Semiconductor Material

  silicon

• Inclosure Material

  plastic

• Power Rating Per Characteristic

  360.0 milliwatts small-signal input power, common-collector preset

• Maximum Operating Temp Per Measurement Point

  150.0 deg celsius junction

• Overall Length

  0.072 inches minimum and 0.078 inches maximum

• Overall Height

  0.030 inches minimum and 0.040 inches maximum

• Mounting Method

  terminal

• Function For Which Designed

  zener diode

• Features Provided

  gold plated leads

• Precious Material

  gold

• Overall Width

  0.037 inches minimum and 0.043 inches maximum

• Voltage Rating In Volts Per Characteristic

  6.46 minimum breakdown voltage, dc and 7.14 maximum breakdown voltage, dc

• Departure From Cited Document (Non-Core)

  as modified by stswdc05

• Terminal Type And Quantity

  4 bonding pad

• Test Data Document

  98897-mil-s-19500/127 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general