NSN: 5961-01-387-4814

Semiconductor Devices and Associated Hardware

SEMICONDUCTOR DEVICES,UNITIZED

5961 - Semiconductor Devices and Associated Hardware

SEMICONDUCTOR DEVICES,UNITIZED

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Technical Characteristics

  • Terminal Type And Quantity

    6 uninsulated wire lead

  • Precious Material And Location

    leads and terminal pad surfaces option. gold

  • Power Rating Per Characteristic

    300.0 milliwatts maximum total power dissipation single semiconductor device photo

  • Current Rating Per Characteristic

    50.00 milliamperes maximum collector current, dc single semiconductor device photo

  • Voltage Rating In Volts Per Characteristic

    45.0 maximum collector to base voltage/static/emitter open single semiconductor device photo and 40.0 maximum collector to emitter voltage/static/base open and 7.0 maximum emitter to base voltage, static, collector open

  • Voltage Rating In Volts Per Characteristic

    2.0 maximum reverse voltage, instantaneous single light emitting diode

  • Mounting Method

    terminal

  • Component Name And Quantity

    1 light emitting diode and 1 semiconductor device photo

  • Internal Junction Configuration

    npn single semiconductor device photo

  • Terminal Length

    0.500 inches minimum

  • Overall Length

    0.185 inches maximum

  • Precious Material

    gold

  • Special Features

    environmental stress screening per tr169.

  • Maximum Operating Temp Per Measurement Point

    125.0 deg celsius junction

  • Color Tone Produced Per Source

    infrared semiconductor single light emitting diode

  • Current Rating Per Characteristic

    40.00 milliamperes maximum forward current, dc single light emitting diode

  • Semiconductor Material

    silicon single semiconductor device photo

  • Semiconductor Material

    gallium arsenide single light emitting diode

  • Field Force Effect Type

    electrostatic charge

  • Internal Junction Configuration

    pn single light emitting diode

  • Channel Polarity And Control Type

    n-channel insulated gate type

  • Internal Configuration

    junction contact all semiconductor

  • Overall Diameter

    0.370 inches maximum

  • Inclosure Material

    metal

Certified to
AS6081 Methods

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