NSN: 5961-01-413-6275

Technical Characteristics

• Mounting Method

  terminal

• Special Features

  junction pattern arrangement: pnp

• Internal Configuration

  junction contact

• Joint Electronic Device Engineering Council/Jedec/Case Outline Designation

  to-236ab

• Terminal Type And Quantity

  3 bonding pad

• Overall Length

  0.1102 inches minimum and 0.1197 inches maximum

• Semiconductor Material

  silicon

• Inclosure Material

  plastic

• Current Rating Per Characteristic

  -500.00 milliamperes source cutoff current maximum

• Voltage Rating In Volts Per Characteristic

  -80.0 maximum collector to emitter voltage/static/base open and -80.0 maximum collector to base voltage/static/emitter open and -4.0 maximum emitter to base voltage, static, collector open

• Transfer Ratio

  50.0 minimum static forward current transfer ratio, common-emitter