NSN: 5961-01-414-9173

Technical Characteristics

• Mounting Method

  terminal

• Joint Electronic Device Engineering Council/Jedec/Case Outline Designation

  to-236ab

• Terminal Type And Quantity

  3 bonding pad

• Semiconductor Material

  silicon

• Inclosure Material

  plastic

• Power Rating Per Characteristic

  350.0 milliwatts small-signal input power, common-collector preset

• Current Rating Per Characteristic

  50.00 milliamperes source cutoff current maximum

• Voltage Rating In Volts Per Characteristic

  12.0 maximum collector to emitter voltage/static/base open and 20.0 maximum collector to base voltage/static/emitter open and 2.5 maximum emitter to base voltage, static, collector open