NSN: 5962-00-137-5012

Technical Characteristics

• Word Quantity (Non-Core)

  256

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Inclosure Configuration

  flat pack

• Bit Quantity (Non-Core)

  3072

• Body Width

  0.390 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Memory Device Type

  rom

• Maximum Power Dissipation Rating

  307.2 milliwatts

• Terminal Surface Treatment

  solder

• Body Length

  0.390 inches maximum

• Output Logic Form

  p-type metal oxide-semiconductor logic

• Input Circuit Pattern

  12 input

• Inclosure Material

  ceramic and glass

• Test Data Document

  09128-d34005544 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Time Rating Per Chacteristic

  900.00 nanoseconds maximum propagation delay time, low to high level output

• Body Height

  0.070 inches maximum

• Voltage Rating And Type Per Characteristic

  -20.0 volts minimum power source and 8.3 volts maximum power source

• Features Provided

  programmed and w/enable and programmable and unipolar and negative outputs and bipolar and positive outputs and monolithic and hermetically sealed and wire-or outputs

• Terminal Type And Quantity

  30 flat leads