NSN: 5962-00-434-3135

Technical Characteristics

• Test Data Document

  13499-351-8102 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Inclosure Configuration

  flat pack

• Inclosure Material

  glass and metal

• Precious Material

  gold

• Voltage Rating And Type Per Characteristic

  0.3 volts maximum power source

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Memory Device Type

  rom

• Body Height

  0.050 inches minimum and 0.070 inches maximum

• Terminal Surface Treatment

  solder

• Body Outside Diameter

  0.550 inches maximum

• Output Logic Form

  p-type metal oxide-semiconductor logic

• Terminal Type And Quantity

  22 flat leads

• Precious Material And Location

  terminal and top and bottom pkg surfaces gold

• Input Circuit Pattern

  2 input

• Time Rating Per Chacteristic

  80.00 nanoseconds maximum propagation delay time, low to high level output and 80.00 nanoseconds maximum propagation delay time, high to low level output

• Features Provided

  monolithic and hermetically sealed and w/enable

• Maximum Power Dissipation Rating

  150.0 milliwatts