NSN: 5962-01-094-9069

Technical Characteristics

• Inclosure Material

  ceramic

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 25.0 volts maximum power source

• Terminal Surface Treatment

  solder

• Body Width

  0.275 inches minimum and 0.310 inches maximum

• Inclosure Configuration

  dual-in-line

• Storage Temp Range

  -55.0/+150.0 deg celsius

• Features Provided

  monolithic and w/strobe and dynamic and hermetically sealed and w/enable

• Body Length

  0.780 inches minimum and 0.820 inches maximum

• Bit Quantity (Non-Core)

  4096

• Test Data Document

  21101-49a0295 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Maximum Power Dissipation Rating

  1.25 watts

• Body Height

  0.185 inches maximum

• Operating Temp Range

  +0.0/+70.0 deg celsius

• Memory Capacity

  unknown

• Time Rating Per Chacteristic

  50.00 nanoseconds maximum propagation delay time, low to high level output and 50.00 nanoseconds maximum propagation delay time, high to low level output

• Input Circuit Pattern

  10 input

• Terminal Type And Quantity

  16 printed circuit

• Memory Device Type

  rom