NSN: 5962-01-108-1966
Microcircuits, Electronic
MICROCIRCUIT,DIGITAL
- Rca Corp
- Rca Corp
- Rca Corp
- Lockheed Martin Corporation
- Lockheed Martin Corporation
- Freescale Semiconductor Inc.
- Fairchild Semiconductor Corp
- Electrodynamics Inc.
- Rockwell Collins Inc.
- Litton Systems Inc. Div Navigation
- Defense Electronics Supply Center
- Harris Corp
- Harris Corp
- Agilent Technologies Inc.
- Motorola/Codex Corp
- National Semiconductor Corporation
- National Semiconductor Corporation
- National Semiconductor Corporation
- Honeywell International Inc
- Hewlett Packard Co
- Hewlett Packard Co
- Allegro Microsystems Inc
- Eaton Corporation
- Raytheon E-Systems Inc
- Motorola, Inc.
- Systron-Donner Corp
- Honeywell Intl Inc
- Dla Land And Maritime
- Dla Land And Maritime
- Dla Land And Maritime
- Dla Land And Maritime
- Telephonics Corporation
- Woodward Hrt Inc.
- Ge Aviation Systems Llc
- Honeywell International Inc
- Boeing Company The
- Boeing Company The
- Cubic Defense Applications Inc.
- Rockwell Collins Inc.
- National Security Agency
- National Security Agency
- Hamilton Sundstrand Corporation
- Eads Deutschland Gmbh -Verteidigung
- Telefunken Radio Communication
- Thales Defence & Security Systems
- Thales
- Mod Des Iss-Eo
5962 - Microcircuits, Electronic
MICROCIRCUIT,DIGITAL
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Technical Characteristics
-
Test Data Document
14933-79014 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
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Voltage Rating And Type Per Characteristic
18.0 volts maximum power source
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Features Provided
hermetically sealed and monolithic and positive outputs
-
Output Logic Form
complementary-metal oxide-semiconductor logic
-
Body Height
0.140 inches minimum and 0.185 inches maximum
-
Terminal Type And Quantity
16 printed circuit
-
Storage Temp Range
-65.0/+150.0 deg celsius
-
Body Length
0.840 inches maximum
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Design Function And Quantity
6 buffer, inverting
-
Body Width
0.220 inches minimum and 0.310 inches maximum
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Inclosure Material
ceramic
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Terminal Surface Treatment
solder
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Maximum Power Dissipation Rating
500.0 milliwatts
-
Input Circuit Pattern
hex 1 input
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Inclosure Configuration
dual-in-line
-
Operating Temp Range
-55.0/+125.0 deg celsius
-
Case Outline Source And Designator
d-2 mil-m-38510
Related Parts by Category
Related Manufacturers
- Rca Corp
- Rca Corp
- Rca Corp
- Lockheed Martin Corporation
- Lockheed Martin Corporation
- Freescale Semiconductor Inc.
- Fairchild Semiconductor Corp
- Electrodynamics Inc.
- Rockwell Collins Inc.
- Litton Systems Inc. Div Navigation
- Defense Electronics Supply Center
- Harris Corp
- Harris Corp
- Agilent Technologies Inc.
- Motorola/Codex Corp
- National Semiconductor Corporation
- National Semiconductor Corporation
- National Semiconductor Corporation
- Honeywell International Inc
- Hewlett Packard Co
- Hewlett Packard Co
- Allegro Microsystems Inc
- Eaton Corporation
- Raytheon E-Systems Inc
- Motorola, Inc.
- Systron-Donner Corp
- Honeywell Intl Inc
- Dla Land And Maritime
- Dla Land And Maritime
- Dla Land And Maritime
- Dla Land And Maritime
- Telephonics Corporation
- Woodward Hrt Inc.
- Ge Aviation Systems Llc
- Honeywell International Inc
- Boeing Company The
- Boeing Company The
- Cubic Defense Applications Inc.
- Rockwell Collins Inc.
- National Security Agency
- National Security Agency
- Hamilton Sundstrand Corporation
- Eads Deutschland Gmbh -Verteidigung
- Telefunken Radio Communication
- Thales Defence & Security Systems
- Thales
- Mod Des Iss-Eo