NSN: 5962-01-126-9336

Technical Characteristics

• Memory Device Type

  rom

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Body Height

  0.080 inches minimum and 0.130 inches maximum

• Features Provided

  monolithic and programmable and burn in

• Inclosure Configuration

  dual-in-line

• Body Width

  0.560 inches minimum and 0.600 inches maximum

• Body Length

  1.180 inches minimum and 1.220 inches maximum

• Terminal Type And Quantity

  24 printed circuit

• Test Data Document

  16340-64-00009 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Operating Temp Range

  -55.0/+70.0 deg celsius

• Word Quantity (Non-Core)

  256

• Voltage Rating And Type Per Characteristic

  -20.0 volts minimum power source and 0.5 volts maximum power source

• Storage Temp Range

  -65.0/+125.0 deg celsius

• Input Circuit Pattern

  8 input

• Output Logic Form

  metal oxide-semiconductor logic

• Bit Quantity (Non-Core)

  2048