NSN: 5962-01-192-0217

Technical Characteristics

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Body Width

  0.355 inches minimum and 0.395 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Memory Device Type

  rom

• Inclosure Material

  ceramic

• Body Length

  0.355 inches minimum and 0.395 inches maximum

• Terminal Surface Treatment

  solder

• Terminal Type And Quantity

  22 flat leads

• Time Rating Per Chacteristic

  220.00 nanoseconds maximum propagation delay time, low to high level output and 220.00 nanoseconds maximum propagation delay time, high to low level output

• Bit Quantity (Non-Core)

  1024

• Body Height

  0.085 inches maximum

• Voltage Rating And Type Per Characteristic

  8.3 volts maximum power source

• Word Quantity (Non-Core)

  256

• Features Provided

  w/enable and monolithic and hermetically sealed and burn in

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Input Circuit Pattern

  16 input

• Inclosure Configuration

  flat pack