NSN: 5962-01-271-5534

Technical Characteristics

• Inclosure Material

  plastic

• Features Provided

  dynamic and low power and monolithic

• Inclosure Configuration

  dual-in-line

• Storage Temp Range

  -55.0/+125.0 deg celsius

• Input Circuit Pattern

  12 input

• Terminal Surface Treatment

  solder

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Type And Quantity

  16 printed circuit

• Body Width

  0.250 inches nominal

• Memory Device Type

  ram

• Body Height

  0.130 inches nominal

• Operating Temp Range

  -0.0/+70.0 deg celsius

• Bit Quantity (Non-Core)

  262144

• Voltage Rating And Type Per Characteristic

  -1.0 volts minimum power source and 7.0 volts maximum power source

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Word Quantity (Non-Core)

  262144

• Body Length

  0.750 inches nominal

• Time Rating Per Chacteristic

  120.00 nanoseconds maximum propagation delay time, low to high level output and 120.00 nanoseconds maximum propagation delay time, high to low level output