NSN: 5962-01-287-3367

Technical Characteristics

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Configuration

  leadless flat pack

• Input Circuit Pattern

  23 input

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Case Outline Source And Designator

  c-12 mil-m-38510

• Body Height

  0.060 inches minimum and 0.120 inches maximum

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Bit Quantity (Non-Core)

  65536

• Time Rating Per Chacteristic

  30.00 nanoseconds maximum propagation delay time, low to high level output and 30.00 nanoseconds maximum propagation delay time, high to low level output

• Terminal Type And Quantity

  32 leadless

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Body Length

  0.540 inches minimum and 0.560 inches maximum

• Memory Device Type

  ram

• Word Quantity (Non-Core)

  8192

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Body Width

  0.442 inches minimum and 0.458 inches maximum

• Features Provided

  low power and electrostatic sensitive and high speed