NSN: 5962-01-303-8872

Technical Characteristics

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Memory Device Type

  ram

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Features Provided

  electrostatic sensitive and hermetically sealed and burn in and static operation

• Inclosure Configuration

  dual-in-line

• Word Quantity (Non-Core)

  2048

• Body Length

  2.370 inches minimum and 2.430 inches maximum

• Bit Quantity (Non-Core)

  16384

• Time Rating Per Chacteristic

  120.00 nanoseconds maximum propagation delay time, low to high level output and 120.00 nanoseconds maximum propagation delay time, high to low level output

• Maximum Power Dissipation Rating

  1.5 watts

• Body Width

  0.550 inches minimum and 0.610 inches maximum

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Terminal Type And Quantity

  48 printed circuit

• Body Height

  0.040 inches minimum and 0.170 inches maximum