NSN: 5962-01-307-2587

Technical Characteristics

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Memory Device Type

  pal

• Maximum Power Dissipation Rating

  650.0 milliwatts

• Overall Height

  0.325 inches minimum and 0.400 inches maximum

• Input Circuit Pattern

  22 input

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Time Rating Per Chacteristic

  55.00 nanoseconds maximum propagation delay time, low to high level output and 55.00 nanoseconds maximum propagation delay time, high to low level output

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Body Height

  0.140 inches minimum and 0.185 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Body Width

  0.220 inches minimum and 0.310 inches maximum

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Case Outline Source And Designator

  d-9 mil-m-38510

• Inclosure Configuration

  dual-in-line

• Terminal Type And Quantity

  24 printed circuit

• Body Length

  1.280 inches maximum

• Features Provided

  programmable and burn in and hermetically sealed and w/clock