NSN: 5962-01-323-6964

Technical Characteristics

• Body Width

  0.220 inches minimum and 0.310 inches maximum

• Body Height

  0.140 inches minimum and 0.185 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• ~1

  tatic operation and w/enable

• Inclosure Material

  ceramic

• Inclosure Configuration

  dual-in-line

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Input Circuit Pattern

  22 input

• Word Quantity

  65536

• Terminal Surface Treatment

  solder

• Terminal Type And Quantity

  24 printed circuit

• Body Length

  1.280 inches maximum

• Maximum Power Dissipation Rating

  1.0 watts

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Features Provided

  electrostatic sensitive and hermetically sealed and burn in and monolithic and s

• Bit Quantity

  262144

• Case Outline Source And Designator

  d-9 mil-m-38510

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• ~1

  5.00 nanoseconds maximum propagation delay time, high to low level output

• Time Rating Per Chacteristic

  45.00 nanoseconds maximum propagation delay time, low to high level output and 4

• Memory Device Type

  ram

• Unpackaged Unit Weight

  6.5 grams

• Test Data Document

  96906-mil-std-883 standard