NSN: 5962-01-324-5168

Technical Characteristics

• Test Data Document

  81349-mil-m-38510 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• ~1

  data on certain environmental and performanc

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Configuration

  leadless flat pack

• Current Rating Per Characteristic

  50.00 milliamperes forward current, maximum peak total value not applicable

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Body Height

  0.064 inches minimum and 0.078 inches maximum

• Input Circuit Pattern

  19 input

• Body Length

  0.484 inches minimum and 0.496 inches maximum

• Memory Device Type

  ram

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Terminal Surface Treatment

  solder

• Features Provided

  burn in and hermetically sealed and static operation and monolithic

• Terminal Type And Quantity

  22 flat leads

• Voltage Rating And Type Per Characteristic

  5.5 volts maximum power source

• Specification/Standard Data

  81349-mil-m-38510/292 government specification

• Body Width

  0.284 inches minimum and 0.296 inches maximum

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Bit Quantity (Non-Core)

  65536

• Word Quantity (Non-Core)

  65536