NSN: 5962-01-330-0703

Technical Characteristics

• Maximum Power Dissipation Rating

  495.0 milliwatts

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Memory Device Type

  rom

• Inclosure Configuration

  leadless flat pack

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Terminal Type And Quantity

  22 leadless

• Voltage Rating And Type Per Characteristic

  5.5 volts maximum power source

• Bit Quantity (Non-Core)

  1024

• Body Height

  0.070 inches minimum and 0.090 inches maximum

• Word Quantity (Non-Core)

  256

• Body Width

  0.284 inches minimum and 0.296 inches maximum

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Input Circuit Pattern

  20 input

• Features Provided

  monolithic and high performance and static operation

• Body Length

  0.484 inches minimum and 0.496 inches maximum

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Output Logic Form

  complementary-metal oxide-semiconductor logic