NSN: 5962-01-338-3258

Technical Characteristics

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Memory Device Type

  pal

• Features Provided

  burn in and programmed

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Inclosure Configuration

  dual-in-line