NSN: 5962-01-358-9647

Microcircuits, Electronic

MICROCIRCUIT,MEMORY

5962 - Microcircuits, Electronic

MICROCIRCUIT,MEMORY

ACT NOW! SUBMIT A QUICK QUOTE.

Technical Characteristics

  • Operating Temp Range

    -55.0/+125.0 deg celsius

  • Memory Device Type

    pal

  • Body Height

    0.185 inches maximum

  • Voltage Rating And Type Per Characteristic

    -0.5 volts minimum power source and 7.0 volts maximum power source

  • Maximum Power Dissipation Rating

    1.1 watts

  • Time Rating Per Chacteristic

    40.00 nanoseconds maximum delay

  • Input Circuit Pattern

    22 input

  • Test Data Document

    96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

  • Storage Temp Range

    -65.0/+150.0 deg celsius

  • Features Provided

    bipolar and monolithic and burn in and hermetically sealed and positive outputs and electrostatic sensitive

  • Body Width

    0.220 inches minimum and 0.310 inches maximum

  • Inclosure Material

    ceramic

  • Current Rating Per Characteristic

    200.00 milliamperes reverse current, dc absolute

  • Terminal Surface Treatment

    solder

  • Part Name Assigned By Controlling Agency

    registered and-or logic array

  • Case Outline Source And Designator

    d-9 mil-m-38510

  • Inclosure Configuration

    dual-in-line

  • Terminal Type And Quantity

    24 printed circuit

  • Body Length

    1.280 inches maximum

  • Output Logic Form

    transistor-transistor logic

Certified to
AS6081 Methods

Implementing Quality Procurement

A rigorous vendor selection process and vendor management system are essential to ensuring quality.
Read more...

Supplying Quality Products

We take every measure to ensure that we supply quality, authentic parts including a strict vendor selection process and rigorous product inspections..
Read more...

Providing Quality People

Our team of dedicated account managers, procurement professionals and specialized inspectors is the most valuable resource we have.
Read more...