NSN: 5962-01-393-7823

Technical Characteristics

• Memory Device Type

  eeprom

• Terminal Surface Treatment

  solder

• Inclosure Material

  ceramic

• Inclosure Configuration

  leadless flat pack

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Word Quantity (Non-Core)

  32768

• Time Rating Per Chacteristic

  250.00 nanoseconds maximum access

• Terminal Type And Quantity

  32 leadless

• Bit Quantity (Non-Core)

  262144

• Features Provided

  w/enable and monolithic and hermetically sealed and programmable

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Voltage Rating And Type Per Characteristic

  6.25 volts maximum power source