NSN: 5962-01-600-4143

Technical Characteristics

• Terminal Type And Quantity

  775 bonding pad

• Voltage Rating And Type Per Characteristic

  -0.3 volts maximum power source and 1.4 volts maximum power source

• Part Name Assigned By Controlling Agency

  mpu core 2 duo 2.8 ghz processor

• Design Function And Quantity

  1 processor, input/output

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Inclosure Configuration

  pin grid array

• Inclosure Material

  plastic

• Storage Temp Range

  -40.0/+85.0 deg celsius

• Body Height

  3.8 millimeters minimum and 4.2 millimeters maximum

• Body Width

  37.4 millimeters minimum and 37.5 millimeters maximum

• Body Length

  37.4 millimeters minimum and 37.5 millimeters maximum